Conductive polymer interconnection configurations

ABSTRACT

Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.

BACKGROUND OF THE INVENTION

The present invention relates generally to the coupling of twoelectrical devices, and specifically to the coupling of integratedcircuit chips to electronic cards using interconnections comprisingconductive polymers.

Electrical components such as semiconductor devices and integratedcircuit chips are, in general, mounted on a printed circuit board or“card” in order to be electrically connected with other electricaldevices. The electrical connection from the first electrical componentto the second electrical component is formed between external electrodesor contact pads on the first component to contact pads on the secondcomponent. The contact pads on each component are arranged to align withthe matching contact pads on the other component.

Various methods for connecting the contact pads on the first componentwith the contact pads on the other component are known in the art,including use of ball grid arrays (BGAs), column grid arrays (CGAs), andland grid arrays (LGAs). For example, electrically conductive bonds thatmechanically and electrically connect the first component and the secondcomponent at each pair of matching contact pads can be formed usingsolder balls. Solder balls are units of essentially sphere-shaped,solidified solder that have been applied to the contact pads of thefirst component. When all of the desired contact pads on the firstcomponent have had a solder ball applied, the component is said tocomprise a “ball grid array,” or bump grid array. The ball grid array isplaced so as to align each solder ball on the first component with thematching contact pads on the second component. FIG. 1a shows anelectrical component with a ball grid array aligned over the substrateof a second component generally at 10. The first component 12 has aplurality of contact pads 14, onto each of which is affixed a solderball 16. The second component substrate 18 has contact pads 20 alignedin a matching configuration to the first component contact pads 14.

FIG. 1b shows the configuration of the ball grid array after the solderballs 16 in the ball grid array have been placed in contact with thecontact pads 20 on the second component substrate 18. Typically, thefirst component 12 is positioned in a parallel plane to the secondcomponent substrate 18, and a slight force is applied to the firstcomponent 12 to ensure contact between the entire ball grid array andthe contact pads 20 on the second component substrate 18. The ball gridarray is then heated, which causes the solder to reflow. The assembly isthen allowed to cool. As shown in FIG. 1c, the final assembly comprisessoldered interconnections 22 between the contact pads 14 of the firstcomponent 12 and the contact pads 20 of the second component substrate18.

Conventional ball grid arrays, however, are not sufficiently resistantto interconnection breakage caused by differential expansion of thecomponents. As the distance from the neutral point (where little or nointerconnection stress occurs) of an interconnection increases, thereliability of that interconnection diminishes, because greater shearstresses are imparted on the interconnection.

Techniques have been developed to increase the distance between anelectrical component and the substrate it is mounted on in order toprovide for longer interconnections than can be achieved with a simpleball grid array. For example, multiple layers of solder balls orconductor layers can be used to increase the final distance between thecomponent and the substrate (See, for example, U.S. Pat. No. 5,816,478to Kaskoun and U.S. Pat. No. 5,641,113 to Somaki et al.). Although suchlengthened interconnections are useful for larger substrates, theinterconnections cannot be formed close enough to each other on a singlesubstrate to allow use in many applications that require a higherdensity of interconnections on a component.

Interconnections formed through the various conventional techniquesdescribed above produce soldered connections that are prone tomalfunction because the interconnections are relatively inflexible andtherefore unable to withstand shearing forces created by the differingcoefficients of thermal expansion of the materials in the components andinterconnections.

What is needed in the art is an interconnection that allows for theready incorporation of flexible and durable interconnections between thecontact pads of two electrical devices.

BRIEF SUMMARY OF THE INVENTION

The above-described and other disadvantages of the prior art areovercome or alleviated by the interconnection of the present invention,which comprises a conductive polymer comprising a polymer component anda conductive component, and a first solderable cap disposed in contactwith said conductive polymer.

In another embodiment, the interconnections of the present inventioncomprises a conductive polymer comprising a polymer component and aconductive component, a first solderable cap disposed in contact withsaid conductive polymer, and a second solderable cap disposed in contactwith said conductive polymer opposite said first solderable cap.

The present invention is also a method for incorporating aninterconnection between two electrical components comprising bonding aninterconnection on a first contact pad of a first component, whereinsaid interconnection comprises a conductive polymer comprising a polymercomponent and a conductive component, and a first solderable capdisposed in contact with said conductive polymer, and then solderingsaid first solderable cap to a second contact pad of a second component.

The present invention is also a method for incorporating aninterconnection between two electrical components comprising soldering asecond solderable cap of an interconnection to a first contact pad of afirst component, wherein said interconnection comprises a conductivepolymer comprising a polymer component and a conductive component, afirst solderable cap disposed in contact with said conductive polymer,and said second solderable cap disposed in contact with said conductivepolymer opposite said first solderable cap, and then soldering saidfirst solderable cap to a second contact pad of a second component.

The above-described and other features and advantages of the presentinvention will be appreciated and understood by those skilled in the artfrom the following detailed description, drawings, and appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The device and method of the present invention will now be described byway of example only, with reference to the accompanying drawings, whichare meant to be exemplary, not limiting, and wherein like elements arenumbered alike in several FIGURES, in which:

FIG. 1a is a cross section of a prior art electrical component with aball grid array and a substrate prior to physical contact;

FIG. 1b is a cross section of the prior art electrical component andsubstrate of FIG. 1 with the ball grid array moved into contact with thecontact pads of the substrate;

FIG. 1c is a cross section of the prior art electrical component andsubstrate of FIG. 1b after reflow of the solder balls in the ball gridarray;

FIG. 2 is a cross sectional view of one embodiment of a conductivepolymer interconnection;

FIG. 3 is a plot showing the resistance of several different conductivepolymers;

FIG. 4 is a cross sectional view of one embodiment of a conductivepolymer interconnection showing serrated caps;

FIG. 5a is a cross sectional view of one embodiment of conductivepolymer interconnections affixed to the contact pads of an electricalcomponent;

FIG. 5b is a cross sectional view of the conductive polymerinterconnections of FIG. 5a after a second electrical component has beenaligned with the conductive polymer interconnections;

FIG. 5c is a cross sectional view of the conductive polymerinterconnections of FIG. 5b after completion of attachment;

FIG. 6a is a cross section of one embodiment of a conductive polymerinterconnection;

FIG. 6b is a cross section of one embodiment of a conductive polymerinterconnection;

FIG. 6c is a cross section of one embodiment of a conductive polymerinterconnection;

FIG. 6d is a cross section of one embodiment of a conductive polymerinterconnection;

FIG. 7 is a cross sectional view of one embodiment of a conductivepolymer interconnection having only a single cap;

FIG. 8 is a cross sectional view of two embodiments of conductivepolymer interconnections having a solder ball as the single cap; and,

FIG. 9 is a plot showing the preferred application range of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

The conductive polymer interconnection described herein comprises aconductive polymer material disposed between two layers of a solderablematerial, or between a solderable material and the contact pad of anelectrical device. In either case, the conductive polymer material hasadhesive properties, and is bonded to adjacent conductors. The resultingconductive polymer interconnection provides a flexible, yet strongconnection between electrical devices, without significantlycomplicating incorporation of the interconnections during componentfabrication. While the interconnection will be described in relation tofabrication of electrical devices, it is understood that the conductivepolymer interconnection described herein is equally applicable totemporary bonding methods, such as “known good die” tests.

Further, for clarity and convenience, the conductive polymerinterconnections will be described as joining an electrical componentsuch as a packaged integrated circuit (IC) substrate to a card, butthose skilled in the art will recognize that the methods and devicesdescribed herein are generally applicable to the joining of twoelectrical devices.

Referring now to FIG. 2, one embodiment of a conductive polymerinterconnection is shown generally at 30. The conductive polymerinterconnection 30 comprises a conductive polymer 32 disposed betweenand in physical contact with a second solderable cap 34 and a firstsolderable cap 36. The conductive polymer 32 has adhesive properties,and it adheres to both solderable caps 34, 36 to form the conductivepolymer interconnection 30 of this embodiment. The shape and size of thesolderable caps 34, 36 and conductive polymer 32 can be any shape andsize that suits the particular application in which the conductivepolymer interconnection 30 will be used. The shape of the solderablecaps 34, 36 and conductive polymer 32 layers, when viewed through crosssection A—A′, can be, for example, circular, triangular, rectangular,elliptical, quadrilateral, and polygonal, among others. The solderablecaps 34, 36 and conductive polymer 32 layers can each have differentshapes or similar shapes as seen in cross section A—A′ in thisembodiment, with substantially similar shapes preferred.

The width “w” of each of the solderable caps 34, 36 and conductivepolymer 32 is dependent upon the application, and can be the same ordifferent for each of the solderable caps 34, 36 and conductive polymer32, with the same width “w” preferred. The width “w” is sufficient toprovide the desired electrical characteristics while providing solidcontact surfaces, with a width “w” of about 0.010 inches to about 0.050preferred, and a width “w” of about 0.015 inches to about 0.035 inchesespecially preferred.

The thickness “t1” of the second solderable cap 34 can be the same as ordifferent from the thickness “t2” of the first solderable cap 36, andthe thickness of the conductive polymer 32 “t3” can be the same as ordifferent from either or both of the solderable caps 34, 36. Thethicknesses of the solderable caps 34, 36 is sufficient to provide abonding surface for the conductive polymer 32 and to provide enoughsolderable material to allow for a sufficiently strong solder joint. Ina preferred embodiment, the solderable caps 34, 36 have approximatelyequivalent thicknesses (t1 and t2), and the conductive polymer 32 has athickness “t3” greater than either of the thicknesses (t1 and t2) ofeither of the two caps 34, 36. In this embodiment, the cap thickness (t1and t2) is about 0.002 inches to about 0.01 inches, with a cap thickness(t1 and t2) of about 0.004 to about 0.006 preferred, and the conductivepolymer 32 thickness (t3) is about 0.002 inches to about 0.058 inches,with a thickness of about 0.008 inches to about 0.02 inches preferred.

The solderable caps 34, 36 can be the same or different material, withthe same material preferred. Further, the solderable caps 34, 36 canhave a non-uniform composition. For example, the caps 34, 36 can beformed so the surface to which the conductive polymer 32 adheres on eachcap 34, 36 has characteristics favorable for such adherence, while thesurface which is soldered to one of the contact pads is amenable tosoldering.

Any conventional solderable material to which the conductive polymer 32can adhere can be used for the solderable caps 34, 36. For example, thesolderable caps 34, 36 can be gold, nickel, silver, copper, zinc,palladium, platinum, indium, tin, bismuth, lead, and the like, andcombinations comprising at least one of the foregoing, with nickel,copper, and gold preferred. Additives can be included in all or part ofeach solderable cap 34, 36 in order to improve the solderability of thesolderable caps 34, 36, or to improve the adherence to the conductivepolymer 32.

The conductive polymer 32 can comprise any polymer composition thatprovides sufficient adherence to the solderable caps 34, 36, sufficientconductivity, and sufficient physical flexibility and durability. U.S.Pat. No. 5,747,101 to Booth et al. discloses several exemplary polymersthat can be used, and is herein incorporated by reference in itsentirety.

Exemplary conductive polymers 32 comprise polymer systems with aconductive component and a polymer component. The conductive componentpreferably comprises electrically conductive particles covered by,coated with, or comprising gold, silver, and palladium or their oxidefree, noble alloys, noble metals, or other conductors and the like,among others. The particles can have any shape, including flakes,spheres, fibers, plates, rods, and disks, among others. In oneembodiment, the particles have a bimodal size distribution. Preferredpolymer components include thermoplastic polymers, copolymers, orblends. Examples of polymers include, but are not limited to, nylons,polysulfones, polyesters, flexible and soluble polyimides, andsiloxanes. Copolymers include, but are not limited to, random, segmentedor block copolymers made of ethylene and vinyl acetate (EVA), siloxaneand aryl-ethers, polyurethanes composed of polyisocyanate, andpolyethers or polyester segments. Blends may be of two or morepolymers/copolymers such as ethylene-acrylate copolymer withpolyethylene, EVA and poly (vinyl chloride) (PVC), polyester and PVC,and the like, among others. The polymer component can additionallycomprise dielectric solids, which preferably include ceramic particles,quartz, or glass.

FIG. 3 shows the resistance through several conductive polymer cylindersversus the thickness “t3” of the conductive polymer from one cap to theother (i.e., one flat surface of the conductive polymer cylinder to theother). Each of the five lines shown represents a single exemplaryconductive polymer composition comprising silicon, epoxy, or both. Theresistivity “ρ” of each material in ohm centimeters, and the diameter“w” of the cylinder in inches for each conductive polymer are asfollows: line 50, ρ=0.004 Ωcm, w=0.03″; line 52, ρ=0.001 Ωcm, w=0.02″;line 54, ρ=0.001 Ωcm, w=0.025″; line 56, ρ=0.001 Ωcm, w=0.03″; and, line58, ρ=0.0001 Ωcm, w=0.03″. The horizontal dashed line represents thenominal limit of resistance for practical use of the conductive polymercylinders in conventional applications. As shown in FIG. 3, a range ofpolymer characteristics can be incorporated in the interconnection,depending upon the required thickness of the conductive polymer in theinterconnection. For example, if the conductive polymer 32 thicknesst3is 0.018″, then the polymer cylinders represented by lines 54, 56, and58 could be utilized successfully in the interconnection. Further,different conductive polymer combinations can be used to increase ordecrease the resistivity as needed in any given application. Theconductive polymers represented in FIG. 3 are exemplary, and, asdiscussed above, many other geometries are possible and within the scopeof this invention.

Fabrication of the interconnection begins with formation of the caps 34,36. The cap material is formed into the desired shape using conventionaltechniques, such as casting, pressing, stamping, coining, or etching,with coining preferred.

If the conductive polymer is a thermoplastic polymer, an appropriatelyshaped plug of the fully polymerized conductive polymer 32 is applied toa cap. The plug is formed using conventional techniques, such as screenprinting, casting columns, extrusion processes, molding, or punching,with casting preferred. An opposing cap is then applied to theconductive polymer 32 opposite the first cap, and the thermoplasticconductive polymer 32 is heated to bind the caps 34, 36 to theconductive polymer 32. The resulting interconnection is shown in FIG. 2.If the conductive polymer is not a thermoplastic polymer, a thin layerof a conductive thermoplastic polymer can be formed on the surfaces ofthe non-thermoplastic conductive polymer 32 on which the caps 34, 36will be disposed prior to application of the caps 34, 36 and heating.

Alternatively, the appropriate amount of uncured polymer can be appliedto one of the caps in a viscous liquid state, and the opposing cap canbe moved into the correct final interconnection position relative to thefirst cap, where the opposing cap will be in contact with the uncuredpolymer. The uncured polymer is then cured to complete fabrication ofthe interconnection.

To improve the bond between the caps 34, 36 and the conductive polymer32, the surface of each cap 34, 36 to which the conductive polymer 32bonds can be altered. As shown in FIG. 4, a serration 40 or other formof scoring can be formed on the surface of each of the caps 34, 36. Theserration 40 can be formed in any conventional manner, includingetching, coining, and scoring, among others. The serrations 40 providemore surface area for the bond between the caps 34, 36 and theconductive polymer 32, and help prevent delamination of the caps 34, 36from the conductive polymer 32.

The technique by which the finished interconnection is attached to theintegrated circuit (IC) substrate and the card will now be described.Referring now to FIG. 5a, completed interconnections are affixed to theIC substrate 62 using conventional solder techniques. A connecting layer60 is disposed between each interconnection 30 and substrate contact pad64, and the connecting layer 60 is used to connect the second solderablecap 34 to the IC substrate contact pads 64 during soldering. Theconnecting layer 60 can be solder flux and eutectic solder, or otherconventional soldering materials, among others.

The IC substrate 62 with affixed interconnections 30 can then be used ina conventional manufacturing line in which IC substrates are soldered tocards. The IC substrate 62 with affixed interconnections 30 is movedinto position so as to align the interconnections 30 with the cardcontact pads 70. As shown in FIG. 5b, the contact pads 70 on the card 72have a connecting layer 60 in place in contact with the card contactpads 70. The connecting layers 60 on the card contact pads 70 can beapplied, for example, using conventional masking techniques, and can bethe same material as the connection layers 60 on the IC substrate 62.Referring now to FIG. 5c, the IC substrate 62 with affixedinterconnections 30 is then moved so that the first solderable caps 36contact the connecting layers 60 on the card contact pads 70. Tocomplete the connection, the first solderable caps 36, the card contactpads 70, and the connecting layers 60 on the card contact pads 70 areheated to form a solder connection between the first solderable caps 36and the card contact pads 70. Since each interconnection 30 is connectedto the components through solderable connections, the interconnections30 can be used invisibly in place of ball grid arrays and otherconventional arrays. Further, since the interconnections 30 aresoldered, the IC substrate 62 can be removed from the card 72 byreflowing the solder connections.

FIGS. 6a through 6 d show alternative embodiments of the interconnectiondescribed above. Each of the embodiments shown in FIGS. 6a through 6 dcan be manufactured and incorporated into IC substrates and cards asdescribed above, and can have the same cross sectional geometry,composition, and size, as described above.

FIG. 6a illustrates one embodiment of an interconnection wherein thesecond solderable cap 80 defines a cavity 82. The conductive polymer 84and a top portion 86 of the first solderable cap 88 are disposed withinthe cavity 82. Either solderable cap 80, 88 can be disposed against thecontact pad 64 of the IC substrate 62.

FIG. 6b illustrates another embodiment of an interconnection wherein thesecond solderable cap 90 defines a first cavity 92 and the firstsolderable cap 94 defines a second cavity 96. The second solderable cap90 and the first solderable cap 94 are oriented so that the cavities 92,96 face each other, and the conductive polymer 98 is disposed in contactwith and between the caps 90, 94 and within each cavity 92, 96.

FIG. 6c illustrates another embodiment of an interconnection wherein aconductive solid 100 is disposed between the second solderable cap 102and the first solderable cap 104, and within the conductive polymer 106.The conductive solid 100 can be any shape, with an approximatelysphere-shaped solid preferred, and can be any conductive material thatis compatible with the other components of the interconnection, such ascopper, nickel, gold and alloys and mixtures comprising at least one ofthe foregoing, with gold plated copper or nickel preferred.

FIG. 6d illustrates yet another embodiment of an interconnection,wherein the second solderable cap 110 and the first solderable cap 112each have projections 114 protruding into the conductive polymer 116.The projections 114 can have any shape and orientation relative to thecaps 110, 112, with a cylindrical or rectangular solid shape preferred,and an orthogonal orientation relative to the long axis of the caps 110,112 preferred. The location of the projections 114 can be different, oralternate between the caps 110, 112, as shown in FIG. 6d, or theprojections 114 can be shortened and located opposite each other on thecaps 110, 112. The projections 114 can be the same material as the caps110, 112, or a different material chosen for its physical or electricalproperties.

Although FIGS. 6a through 6 d illustrate several alternative embodimentsof an interconnection, one skilled in the art will realize that othercap and conductive polymer configurations are possible and within thescope of this invention.

In yet another alternative embodiment of the interconnection of thepresent invention, the conductive polymer 32 can be affixed directly tothe contact pads on one of the electronic devices instead of one of thesolderable caps. FIG. 7 illustrates this embodiment. The conductivepolymer 32 in this embodiment is disposed in contact with the contactpad 64 of the IC substrate 62 rather than a solderable cap. The firstsolderable cap 36 is disposed in contact with the conductive polymer 32as before to form a single cap and conductive polymer interconnection130 . Although FIG. 7 shows the conductive polymer 32 disposed incontact with the contact pad 64 of the IC substrate 62, which ispreferable, the interconnection 130 could be inverted, with theconductive polymer 32 disposed in contact with the card contact pad 70and the first solderable cap 36 disposed in contact with a connectinglayer on the IC substrate contact pad 64. Also, the first solderable cap36 can be disposed on the conductive polymer 32 first, and then theconductive polymer 32 can be disposed on the contact pad 64.

In this embodiment, the interconnection 130 is formed as before, exceptthat one of the contact pads 64, 70 is used in place of the secondsolderable cap. For example, in the case of a thermoplastic polymer asabove, in one embodiment, an appropriately shaped plug of conductivepolymer can be placed on each of the contact pads 64 of the IC substrate62, a first solderable cap 36 is located on each of the conductivepolymer plugs, and the interconnection 130 is heated and cooledappropriately to form the interconnection 130. Likewise, for anon-thermoplastic polymer as above, in one embodiment, the uncuredconductive polymer 32 can be applied to the substrate contact pads 64 asa viscous liquid, a first solderable cap can be applied to the uncuredconductive polymer 32, and the conductive polymer 32 can be cured toform the interconnection 130. Further, for this one cap embodiment, allof the variously shaped cap embodiments described above for the two capembodiment can be used, the conductive polymers and caps can comprisethe same materials listed above, the same dimensions as given above forthe caps and the conductive polymer apply, and the methods for formingthe caps, conductive polymer, and interconnection, as well as forincorporating the interconnection into an IC substrate and cardconnection, can be used for this embodiment where appropriate.

In another embodiment of the present invention only the first solderablecap is used, and the first solderable cap is a solder ball. FIG. 8 showstwo different embodiments of an interconnection having a solder ball asthe first solderable cap. The solder balls 122 can be formed in contactwith the conductive polymer 120 is the same manner as before, withcasting column methods preferred, and the conductive polymer 120 andsolder ball 122 interconnection can be applied to the IC substrate 62and card 72 as before. The interconnection arrays formed by thisembodiment are called enhanced ball grid arrays, and can be used in highdensity interconnection applications.

The conductive polymer interconnections described above can be used inapplications where either large IC substrate size or a high densityinterconnection requirement preclude the use of conventional ball gridarrays or column grid arrays. FIG. 9 represents potential applicationsof the above-described interconnections. The y-axis represents the sizeof the IC substrate in millimeters, and the x-axis represents theminimum distance between the centers of interconnections(interconnection pitch or density). Shaded area 156 represents theapplication range of conventional ball grid arrays, and shaded area 152represents the application range of conventional column grid arrays.While column grid arrays overcome the substrate size limitation of ballgrid arrays, however, they do not allow for high interconnectiondensity. Shaded area 154 represents the preferred application range ofenhanced ball grid arrays formed with the one cap solder ballinterconnections of the present invention (the enhanced ball grid arraycan be used in less dense interconnection applications as well, ofcourse). Finally, shaded area 150 represents the preferred applicationrange of the one cap interconnections (not including the solder ballcap) and two cap interconnections described above, both of which can, ofcourse, be successfully used in the other application ranges as well, ifdesired.

While the invention has been described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted forelements thereof without departing from the scope of the invention. Inaddition, many modifications may be made to adapt a particular situationor material to the teachings of the invention without departing from theessential scope thereof. Therefore, it is intended that the inventionnot be limited to the particular embodiments disclosed for carrying outthis invention, but that the invention will include all embodimentsfalling within the scope of the appended claims.

What is claimed is:
 1. An interconnection for connecting two electricalcomponents, comprising: a conductive polymer composition comprising apolymer component and an electrically conductive component; and, a firstsolderable cap disposed in contact with said conductive polymercomposition; wherein said first solderable cap is a solder ball.
 2. Theinterconnection of claim 1, wherein said polymer component comprises athermoplastic polymer, a copolymer, or a blend, and said conductivecomponent comprises electrically conductive particles.
 3. Theinterconnection of claim 2, wherein said polymer component comprises anylon, polysulfone, polyester, polyimide, siloxane, ethylene, vinylacetate, aryl-ether, polyutethane, polyisocyanate, polyether, polyester,acrylate, or polyvinyl chloride.
 4. The interconnection of claim 2wherein said conductive particles comprise gold, silver, palladium,oxide free noble alloys of gold, silver, and palladium, or a noblemetal.
 5. The interconnection of claim 1, wherein said first solderablecap comprises gold, nickel, silver, copper, zinc, palladium, platinum,indium, tin, bismuth, or lead.
 6. The interconnection of claim 1,wherein said first solderable cap has a width and a thickness, and saidwidth is about 0.010 inches to about 0.050 inches, and said thickness isabout 0.002 inches to about 0.01 inches.
 7. The interconnection of claim1, wherein said conductive polymer has a width and a thickness, and saidwidth is about 0.010 inches to about 0.050 inches, and said thickness isabout 0.002 inches to about 0.058 inches.
 8. The interconnection ofclaim 1, wherein said first solderable cap defines a cavity and saidconductive polymer is partially disposed in said cavity.
 9. Theinterconnection of claim 1, wherein said conductive component comprisesa conductive solid disposed within said conductive polymer compositionand in contact with said first solderable cap.
 10. The interconnectionof claim 1, wherein said conductive polymer has a resistivity of lessthan about 0.05 ohms per centimeter.
 11. The interconnection of claim 1,further comprising a second solderable cap disposed in contact with saidconductive polymer opposite said first solderable cap.
 12. Theinterconnection of claim 11, wherein said polymer component comprises athermoplastic polymer, a copolymer, or a blend, and said conductivecomponent comprises electrically conductive particles.
 13. Theinterconnection of claim 12, wherein said polymer component comprises anylon, polysulfone, polyester, polyimide, siloxane, ethylene, vinylacetate, aryl-ether, polyutethane, polyisocyanate, polyether, polyester,acrylate, or polyvinyl chloride.
 14. The interconnection of claim 12wherein said conductive particles comprise gold, silver, palladium,oxide free noble alloys of gold, silver, and palladium, or a noblemetal.
 15. The interconnection of claim 11, wherein said firstsolderable cap and said second solderable cap comprise gold, nickel,silver, copper, zinc, palladium, platinum, indium, tin, bismuth, orlead.
 16. The interconnection of claim 11, wherein said first solderablecap and said second solderable cap each have a width and a thickness,and said width is about 0.010 inches to about 0.050 inches, and saidthickness is about 0.002 inches to about 0.01 inches.
 17. Theinterconnection of claim 11, wherein said conductive polymer has a widthand a thickness, and said width is about 0.010 inches to about 0.050inches, and said thickness is about 0.002 inches to about 0.058 inches.18. The interconnection of claim 11, wherein said first solderable capdefines a first cavity and said second solderable cap defines a secondcavity and said conductive polymer is partially disposed in said firstcavity and said second cavity.
 19. The interconnection of claim 11,wherein a conductive solid is disposed within said conductive polymerand in contact with said first solderable cap and said second solderablecap.
 20. The interconnection of claim 11, wherein said conductivepolymer has a resistivity of less than about 0.05 ohms per centimeter.21. An interconnection for connecting two electrical components,comprising: a conductive polymer composition comprising a polymercomponent and an electrically conductive component; and a firstsolderable cap disposed in contact with said conductive polymercomposition; wherein a plurality of projections are disposed in contactwith said first solderable cap and extend into said conductive polymer.22. An interconnection for connecting two electrical components,comprising: a conductive polymer composition comprising a polymercomponent and an electrically conductive component; a first solderablecap disposed in contact with said conductive polymer composition; and asecond solderable cap disposed in contact with said conductive polymeropposite said first solderable cap; wherein a first plurality ofprojections are disposed in contact with said first solderable cap, asecond plurality of projections are disposed in contact with said secondsolderable cap, and said first plurality of projections and said secondplurality of projections extend into said conductive polymer.